PHIX and Tyndall Institute strengthen their collaboration

PHIX Photonics assembly (PHIX) and PIXAPP Pilot Line Coordinator Tyndall Institute have strengthened their collaboration in the development of the photonic packaging ecosystem by arranging dedicated training of PHIX engineers on Tyndall’s advanced packaging equipment. This sharing of knowledge will strengthen the photonic ecosystem in Europe and assure open access to high volume Photonic Integrated Circuit (PIC) packaging through the PIXAPP Pilot Line.

Find here the complete press release.