ABOUT THIS PROJECT:
PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies. PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.
THE ROLE OF LIONIX INTERNATIONAL:
LioniX International is in the PIXAPP project with the TriPleX® platform in which via spot size converters a complementary combination with the other PIC based platforms can be made. Hybrid combination of different platforms enables new applications and the TriPleX® acts as the photonic backbone there. Due to the vertical integration of LioniX International the role in the PIXAPP project goes much further than just applying TriPleX PICs.
INFORMATION:
Find more information about this project and its progress on the PIXAPP website.
