MEMS Technology

With over 20 years of experience in microsystems fabrication using MEMS technologies, we have developed a valuable array of technologies designed to realize your MEMS device. Deep reactive ion etching and and wafer bonding are key amongst these vital enabling technologies.

Through continual development in our state of the art cleanroom we have refined existing technologies and continue to develop new custom capabilities in partnership with our customers.

You will find an overview of all of our most important MEMS technologies and building blocks below.

Get in touch to talk to our team about your MEMS technology requirements
cantilevers for MEMS

Cantilevers for MEMS

LioniX manufactures silicon & silicon nitride cantilevers with customizable shape and thickness, and reflective or conductive coatings.
Through wafer holes created using deep reactive ion etching of silicon

Deep Reactive Ion Etching for MEMS

Deep reactive ion etching offers exceptional etch anisotropy and mask selectivity. We use it to create deep, vertical sided features, often with high aspect ratios. We specialize in deep reactive ion etching of silicon and other substrates as part of our full range of MEMS technologies.
Red light signals in the TriPleX waveguides of a photic integrated circuit

TriPleX® integrated photonics for optical MEMS

We create high added value optical MEMS (MOEMS) and optofluidics devices. Our expertise in the combination of MEMS and optics is founded on more than 20 years of technological development. Our primary technology is TriPleX® - our proprietary LPCVD silicon nitride photonic platform.